SMTA announced that the program is finalized for the 23rd Annual Pan Pacific Microelectronics Symposium. The event will take place February 5-8, 2018 at the Hapuna Beach Prince Resort on the Big Island of Hawaii. The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
The technical sessions, with over 50 presentations, will include Automotive Systems and Hardware, Materials and Reliability, Inspection and Test Techniques, Cleaning Technologies, Advanced Materials, Interposer and Packaging Technology, Advanced Processes and Packaging, Nontechnology Applications, Advanced Packaging and Processes, Advanced Process, Heterogeneous Integration.
On the afternoon of Monday, February 5, a plenary keynote session will kick off the event featuring presentations on Defense Electronics; The Latest Material Technologies for Systems in Package; Management of Complexity in Research and Development Work; and Selected Highlights From the 2017 iNEMI Roadmap and Key Projects to Address Identified Gaps.
On Tuesday, February 6, Yoshiaki Sakagami, Honda, will deliver the keynote lunch talk on “Honda’s New Mobility System Development Challenge; Key Functions and Devices for Intelligent Mobility System.” On Wednesday, February 7, Dwight Howard, Delphi Automotive, LLC, will deliver the lunch keynote on “Integrated Intelligent Transportation and Key Enablers.” Dongkai Shangguan, Ph.D., Flex, will deliver the final keynote lunch presentation about “Cost Effective Solutions for SiP and Miniaturized Modules” on Thursday, February 8.
SMTA – A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
The SMTA and Chip Scale Review are pleased to announce the Keynote Presenters for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.
Subramanian Iyer, Ph.D., Distinguished Chancellor’s Professor, Electrical Engineering Department, University of California, Los Angeles is scheduled to give the keynote presentation on the first day of the conference on “Packaging without the Package: A More Holistic Moore’s Law.” With the well-documented slowing down of scaling and the advent of the Internet of Things, there is a focus on heterogeneous integration and system-level scaling. Packaging itself is undergoing a transformation that focuses on overall system performance through integration rather than on packaging individual components. The University of California proposes ways in which this transformation can evolve to provide a significant value at the system level while providing a significantly lower barrier to entry compared with a chip-based SoC approach that is currently used. More importantly it will allow us to re-architect systems in a very significant way. This transformation is already under way with 3-D stacking of dies, Wafer level fan-out processing, and will evolve to make heterogeneous integration the backbone of a new SoC methodology, extending to integrate entire Systems on Wafers (SoWs). Professor Iyer will describe the technology his team uses and their results to-date. This has implications in redefining the memory hierarchy in conventional systems and in neuromorphic systems. These concepts are extended to flexible and biocompatible electronics with medical engineering applications.
Richard (Kwang Wook) Bae, Vice President, Corporate Strategy & Planning, Samsung Electro-Mechanics, will deliver the keynote on the second day, entitled “Samsung’s FOPLP: Beyond Moore.” Innovation and economics in semiconductor fabrication have followed Moore’s Law in past decades. However, as front-end processing is facing physical limits and the economic advantage described by Moore’s Law is fading, innovation in back-end processing has become critical. As the industry moves “Beyond Moore,” two questions come to mind: 1) What is the next-generation of packaging, and 2) What features should it have? Related to these topics are a discussion of the characteristics of the fan-out business and the advantage of Samsung’s fan-out panel-level packaging (FOPLP).
Han Byung Joon, Ph.D., Chief Executive Officer, STATS ChipPAC is scheduled to give the keynote presentation in the afternoon on the second day of the conference on “Innovative Packaging Technologies Usher in a New Era for Integration Solutions.” Rapidly evolving demands for greater system performance, increased functionality and reduced form factor are driving three key paradigm shifts in the industry. First, product miniaturization and the modularization of functionality is accelerating growth in system level integration. Second, increasing I/O densities and complex integration requirements in a smaller form factor are leading to a wide range of 2.5D and 3D fan-out wafer level packaging solutions. Third, Chinese fabless customers are requiring sophisticated packaging technologies to be competitive with the top international players. Dr. Han will discuss these important paradigm shifts and how wafer level technology is a key enabler for innovative integration solutions in smartphones, Internet of Things and wearable devices, data storage, networking and automotive electronics.
IPC is a global trade association dedicated to the competitive excellence and financial success of its member companies which represent the electronic interconnect industry.
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