Fuji Corporation continues to demonstrate leadership in SMT technology with two major developments in early 2026: a breakthrough in ultra-small component placement and significant expansion of its smart factory integration capabilities.
World-First 016008 mm Component Placement
In January 2026, Fuji achieved the world's first successful placement of 016008 mm (0.16 x 0.08 mm / 006003") electronic components using its NXTR platform, demonstrated at NEPCON JAPAN 2026 in Tokyo . This breakthrough addresses the accelerating demand for miniaturization driven by edge AI devices, where higher component density is essential for advanced functionality in smartphones, wearables, and medical equipment .
[Image: FUJI NXTR series demonstrating 016008 mm component placement at NEPCON JAPAN 2026]
The achievement is enabled by four key control technologies: real-time stance recognition during handling, highly-accurate pickup control addressing static electricity, super-fine placement pressure control to prevent component damage, and nano-level positioning compensation . These 016008 mm components require approximately half the mounting area of current 0201 mm parts, enabling more compact circuit designs .