Seoul, Korea – Industry leader Koh Young will showcase breakthrough True 3D inspection and metrology solutions at Productronica and SEMICON Europa 2025 (Nov 18–21, Messe München, Germany). Visitors can explore its latest electronics manufacturing and semiconductor packaging advances at two booths: A2.377 (SMT/software) and B1.213 (advanced packaging/semiconductor metrology).
Key Innovations
Koh Young’s new offerings combine True 3D measurement with AI and automation to boost quality, efficiency, and process control:
- THT Inspection: New algorithms for through-hole/press-fit joints reduce defects and rework in mixed-technology assemblies.
- KSMART: Data analytics platform turns inspection data into real-time insights for smart factory optimization.
- KAP Auto-Programming: AI-generated inspection programs cut setup time from hours to minutes.
- Smart Review: Intelligent defect filtering minimizes operator workload and speeds up corrections.
- KY8030-3 SPI: Telecentric lens + 8MP camera deliver sharper solder paste measurement and printing accuracy.
- Zenith 2 AOI: Side-view cameras detect hidden/obscured defects missed by traditional systems.
- Zenith UHS AOI: Inspects tall components (up to 60mm) for EV, power electronics, and data infrastructure.
Featured Technologies
- aSPIre3: High-precision True 3D SPI for fine-pitch/advanced designs.
- Zenith Alpha HS+: High-speed True 3D AOI balancing speed and accuracy for high-volume SMT production.
- Neptune C+: Inspects transparent/conformal coatings via patented LIFT technology.
- Meister D+: Sub-micron accuracy semiconductor metrology for advanced packaging’s reflective/complex surfaces.